The Era of High Bandwidth Memory - Hot Chips High Bandwidth Memory Overview HBM, What Exactly Is It? 3 High Bandwidth Memory – Test Quality Reliability 5 Future TSV based DRAM solutions 5 Next Generation TSV Solutions And many more Thank You!
Verification of Singulated HBM2 stacks with a KGS Test Cell Working together as a team Advantest together with FormFactor developed a production worthy tool for confirming Known-Good Memory Stacks with ~4,000 micro-bumps and < 60um bump pitch The resulting design exceeded our design goals for probe force and CCC with a wide operational temperature range
An Innovative Method and Apparatus for KGSD Testing of 2. 5D and 3D . . . A novel method and associated apparatus tailored for the KGD testing of 2 5D and 3D stacked dies, particularly focusing on High Bandwidth Memory (HBM) have been developed This is important because the distinctive architecture of HBM necessitates the compression of I O contacts into a limited, confined space, posing challenges for conventional probing techniques at the die level To address
Tuition - kgsd All registration fees of $65 00 (per each class) are due on or before the first day of class Please remember this is a non-refundable fee, this will ensure you have a spot for the class YEARLY Tuition: 1st class = $420 per year plus $65 registration fee for each class $485 Total