Spin Coater - Laurell Technologies With tens of thousands of systems installed worldwide since 1985, Laurell Technologies is the world's leading manufacturer of spin coaters and spin processors for the Semiconductor, Biotechnology, and Nanotechnology industries
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Laurell Spin Coater Operating Instructions The purpose of this document is to describe requirements and basic operating instructions for the Model Laurell WS-650 Spin Coater This tool is intended for coating samples of various sizes
Laurell WS-650 Spin Coater GENERAL PROCESS AND OPERATION SPECIFICATION Appendix C: Features of the Laurell WS-650 Spin Coater Digital process controller:100-8000 rpm, with 0 5 rpm resolution, Hold up to 6 inch wafer or 4 inch square substrate, The 650 controller holds up to twenty 51-step programs, 1 75 inch natural propylene vacuum chuck holds 50mm through 150 mm substrates
“Laurell WS-650 Series Spin Coater” — Operation Manual Guide and . . . The Laurell WS-650 Series Spin Coater is a robust and reliable tool when operated and maintained properly Understanding its principles, adhering to operating procedures, and following recommended troubleshooting steps will maximize its efficiency and lifespan
Laurell Technologies - ø150mm Spin Coater WS-650-23 System Specifications A Brief Description: The housing for this system is typically made from a solid co-polymer blend exclusive to Laurell Technologies Unlike pure Natural Polypropylene, this material is able to resist solvents and strong acids and bases Samples are available for testing and verification upon request
STANDARD OPERATING PROCEDURE FOR LAURELL SPINNER SPIN COATER Press “SELECT PROCESS” button Use Up Down Arrow keys ↑↓) keys to move to desired process recipe By default, Ne or Unnamed Processes are named “Program #” Press the "EDIT MODE tton to begin editing desired process recipe To move from l r right use the Left Right Arrow keys (← →) Pre
LAURELL SPIN COATER — Columbia Nano Initiative The laurell spinner is now used for non-standard materials coating such as PDMS etc After a substrate is loaded on to the chuck, vacuum hold-down is engaged from the side mounted control panel and the lid closed, a preprogrammed process is selected and initiated