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- DISCO HI-TEC AMERICA, INC. USA Head Office Sales Service Office | USA . . .
About DISCO DISCO business details, names of executives, number of employees and other basic information are provided
- 株式会社ディスコ - DISCO
ニュース ソフトエンジニアを発掘・支援 「DISCO Equipment Coding Contest」の開催が決定 2024 12 25 ニュース グラインダなどの大流量に対応 純水リサイクル装置「DWR1730」を開発
- 2024 | News | DISCO Corporation
DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools (blades and wheels) used for manufacturing semiconductors and electronic components
- Corporate Philosophy | About DISCO | DISCO Corporation
DISCO Values represent the corporate philosophy that identifies the ideal from various perspectives, including the direction in which the company should progress, the basic approach of management, and the manner in which each and every employee works
- DISCO Corporate History | About DISCO | DISCO Corporation
Since DISCO had transformed itself from a small abrasives shop to a leading manufacturer of precision processing tools and equipment and because the character of the company had changed, in 1977, Dai-Ichi Seitosho Co , Ltd took the D, I, S, and CO in its name and became DISCO
- ニュース | 株式会社ディスコ - DISCO
「DISCO Presentsディスカバリーチャンネル コードコンテスト2022」を開催
- DISCO Corporation
登载了disco的业务内容，董事名，职工人数等有关disco的企业基础信息。
- 2023 | News | DISCO Corporation
DISCO Corporation, a semiconductor manufacturing equipment manufacturer (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya), has developed DDS2020, a fully automatic die separator that supports Φ200 mm tape frames and achieves separation of hard materials including SiC and sapphire
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