Chip-on-Wafer-on-Substrate (CoWoS) - TSMC - WikiChip Chip-on-Wafer-on-Substrate (CoWoS) is a two-point-five dimensional integrated circuit (2 5D IC) through-silicon via (TSV) interposer-based packaging technology designed by TSMC for high-performance applications
CoWoS® - Taiwan Semiconductor Manufacturing Company Limited - TSMC The CoWoS ® -S (Chip on Wafer on Substrate with silicon interposer) platform provides best-in-class package technology for ultra-high performance computing applications, such as artificial intelligence (AI) and super-computing
Understanding CoWoS Packaging Technology - AnySilicon Chip-on-wafer-on-substrate (CoWoS) refers to the advanced packaging technology that offers the advantage of a larger package size and more I O connections It allows 2 5D and 3D stacking of components to enable homogenous and heterogenous integration
What Are CoWoS-S, CoWoS-R, and CoWoS-L? - 7evenguy finance blog What is CoWoS-S? CoWoS-S uses a single silicon interposer and through-silicon vias (TSVs) to achieve high-speed electrical signal transmission between the chip and the substrate However, single silicon interposers often face yield issues What is CoWoS-R?
CoWoS-S, R, L Explained – TSMC’s Advanced Packaging Strategies for AI HPC CoWoS (Chip-on-Wafer-on-Substrate) is TSMC’s flagship 2 5D advanced packaging technology, introduced in 2012 to tackle the post-Moore’s Law performance ceiling It integrates multiple chiplets onto a silicon interposer, which is then connected to a package substrate