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  • semiconductors - What is silicon germanium (SiGe)? - Electrical . . .
    SiGe is a semiconductor alloy, meaning a mixture of two elements, silicon and germanium Since 2000 or so, SiGe has become widely used to enhance the performance of ICs of various types SiGe can be processed on equipment nearly the same as used for ordinary silicon
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    The car analogy isn't such a good one, since electrons don't actually flow from one end of the wire to the other (well they do but extremely slowly) and it implies there is some space between the cars, whereas it would be more like a traffic jam whatever the width of the highway
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    Stack Exchange Network Stack Exchange network consists of 183 Q A communities including Stack Overflow, the largest, most trusted online community for developers to learn, share their knowledge, and build their careers
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    A few days ago I started to learn Altium Designer 17 and immediately stumbled upon some strange behavior I created my first component and decided to see how it will look on paper
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    Stack Exchange Network Stack Exchange network consists of 183 Q A communities including Stack Overflow, the largest, most trusted online community for developers to learn, share their knowledge, and build their careers
  • crimp - wire crimper sizes: mm2 vs AWG - Electrical Engineering Stack . . .
    Electrical wire crimpers available on Amazon Canada tend to list die sizes in mm2 This one cross-lists them in AWG, but there are some discrepancies between these sizes and the mm2 equivalent of
  • Gate Capacitance and Miller Capacitance on the MOSFET
    There is always capacitance between drain and gate which can be a real problem A common MOSFET is the FQP30N06L (60V LOGIC N-Channel MOSFET) it has the following capacitance figures: -
  • Why does MOSFET pinch-off occur?
    This question is about enhanced n-type MOSFETs From what I understand, an inversion layer is formed underneath the insulating layer below the gate of the MOSFET when a voltage is applied to the ga
  • What is the standard procedure for analogue IC tapeout?
    I've been on the periphery of numerous RF chip designs, mainly GaAs, but most recently SiGe (mixed RF digital), and have heard all of the things you've described in design reviews, but usually in bits and pieces This really helped to tie things together \$\endgroup\$ –





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