Home - Octavo Systems Octavo SiPs integrate dozens of PCB components into a footprint smaller than most processors, lowering manufacturing costs by 55% on average Other technologies like SoMs are bulkier and harder to integrate, while SoCs are small but lack the components needed to accelerate a product design Octavo’s next-generation SiPs solve both of these problems by providing a solution that is both
OSDZU3 - Octavo Systems The Octavo Systems OSDZU3-REF is a full featured 4-layer development platform for the OSDZU3 System-in-Package devices Based on the UltraZED PCIe Carrier Card from Avnet the OSDZU3-REF provides access to a host of peripherals and expansion headers to fully evaluate the OSDZU3 in your application
OSD3358-SM-RED - Octavo Systems The OSD3358-SM-RED is Octavo Systems’ Reference, Evaluation, and Development board for the OSD335x families of System-In-Package devices Specifically it is an Octavo Systems board that allows users to quickly evaluate the OSD335x SiP, the OSD335x-SM SiP and the OSD335x C-SiP for their applications
OSD335x-SM - Octavo Systems The Octavo Systems OSD3358-SM-RED platform is the official R eference, E valuation, and D evelopment board for the OSD335x C-SiP and OSD335x-SM families of devices It has many common interfaces and sensors It also has a pair of expansion headers that are compatible with common community supported open source boards
OSD32MP15x - Octavo Systems The Octavo Systems OSD32MP1-BRK is a flexible prototyping platform for the OSD32MP15x System in Package The OSD32MP1-BRK gives access to over 100 I O on the STM32MP1 in a small form factor
Securing the Future: The Integral Role of SiP . . . - Octavo Systems Octavo Systems’ SiP technology not only promises a leap in efficiency and miniaturization but also stands as a bulwark against the myriad of physical threats facing embedded systems today By choosing Octavo, you’re not just selecting a component; you’re opting for a future where security and innovation go hand in hand
OSD335x - Octavo Systems The Octavo Systems OSD335x System-in-Package (SiP) device is the first device in the OSD335x Family It integrates the Texas Instruments Sitara ARM® Cortex®-A8 AM335x Processor, DDR3 memory, TPS65217C PMIC, TL5209 LDO, and all needed passive components into a single 27mm X 27mm BGA package Integrating the DDR3, power system, and passive devices into the single package removes the
octavo products - Octavo Systems PRODUCTS family OSD32MP1 Family OSD32MP2 Family OSD335x Family OSD62 Family OSDZUx Family Overview The OSD32MP15x family is the first fully […]
OSDZU3-REF - Octavo Systems The OSDZU3-REF if a powerful development and evaluation platform for the OSDZU3 System in Package Based on the UltraZed PCIe Carrier Card from Avnet, the OSDZU3-REF is a 4 layer design that features an extensive set of peripherals, including USB 3 0, SATA, Display port, Gigabit Ethernet, and LVDS touch panel support There are several storage options including eMMC and SD card (primary boot
OSD32MP1-BRK - Octavo Systems Its minimal overhead and access to a wide range of I O make the OSD32MP1-BRK the perfect platform for any designer looking for complete flexibility as they prototype their design The OSD32MP1-BRK is designed and manufactured by Allied Component Works, LLC, a member of the Octavo Systems partner network